发明名称 |
Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry |
摘要 |
A method of manufacturing a semiconductor structure includes: forming a trench in a back side of a substrate; depositing a dopant on surfaces of the trench; forming a shallow trench isolation (STI) structure in a top side of the substrate opposite the trench; forming a deep well in the substrate; out-diffusing the dopant into the deep well and the substrate; forming an N-well and a P-well in the substrate; and filling the trench with a conductive material. |
申请公布号 |
US9397010(B2) |
申请公布日期 |
2016.07.19 |
申请号 |
US201614993243 |
申请日期 |
2016.01.12 |
申请人 |
International Business Machines Corporation |
发明人 |
Chapman Phillip F.;Collins David S.;Voldman Steven H. |
分类号 |
H01L21/8238;H01L27/092;H01L21/74 |
主分类号 |
H01L21/8238 |
代理机构 |
Roberts Mlotkowski Safran & Cole, P.C. |
代理人 |
Meyers Steven;Calderon Andrew M.;Roberts Mlotkowski Safran & Cole, P.C. |
主权项 |
1. A method of manufacturing a semiconductor structure, comprising:
forming an NFET device having a P-well at a top side of a substrate; forming a PFET device having an N-well at the top side of the substrate; and forming a substrate contact comprising a through wafer via extending from a backside of the substrate to a bottom surface of an isolation structure located between the NFET device and the PFET device, wherein the isolation structure comprises a shallow trench isolation (STI) structure and an isolation feature that abuts and extends below the STI structure. |
地址 |
Armonk NY US |