Top gated method for manufacturing a data carrier

摘要

A method for manufacturing a portable data carrier includes the steps of: providing a carrier band having an upper side and a lower side disposed opposite the upper side including a contact field formed with at least one contact area; arranging a semiconductor circuit on the lower side of the carrier band and electroconductively connected with the corresponding contact area; and carrying out an injection molding process on the lower side a potting compound formed around the semiconductor circuit and having outer dimensions according to a portable data carrier standard specification. An injection channel for injecting the potting compound is arranged on a side of the potting compound mold parallel to the lower side, and after the injection of the potting compound a depression remains in the finished data carrier due to the injection channel. A portable data carrier includes the features and is used as a subscriber identity module.

主权项

1. A method for manufacturing a portable data carrier having the method steps of:
making available a carrier band having an upper side and a lower side disposed opposite the upper side, wherein on the upper side a contact field is formed having at least one contact area; arranging a semiconductor circuit on the lower side of the carrier band, wherein the semiconductor circuit is electroconductively connected with the corresponding contact area; and executing a top gated injection molding process in that on the lower side a first potting compound is formed around the semiconductor circuit, wherein said first potting compound has the outer dimensions in accordance with a predetermined specification of a portable data carrier, wherein the semiconductor circuit is encapsulated by a second potting compound before the injection molding process and wherein the first potting compound has improved flow properties from the second potting compound that provides ease in forming a depression and achieving a smaller corner radius and a steeper flank angle, wherein after the injection of the potting compound a depression remains in the finished data carrier and is centered on a lower side of the data carrier body.