Charge sharing testing of through-body-vias

摘要

In accordance with one aspect of the present description, an integrated circuit die has a plurality of through-body-vias and a testing circuit on board the die which allows charges on a first and second through-body-via to redistribute between them to provide an indication whether one or both of the first and second through-body-vias has a defect. Other aspects are described.

主权项

1. A method, comprising:
setting a voltage level of a first through-body-via to a first voltage level; setting a voltage level of a second through-body-via to a second voltage level lower than the first voltage level; allowing charges on the first and second through-body-vias to redistribute between them to provide a common, third voltage level on the first and second through-body-vias, said third voltage level being between the first and second voltage levels and a function of the respective capacitances of the first and second through-body-vias; and determining whether the one or both of the first and second through-body-vias has a defect as a function of the common, third voltage level wherein the determining includes comparing the common, third voltage level to a first threshold level lower than the first voltage level, and comparing the common, third voltage level to a second threshold level higher than the second voltage level, wherein said second threshold level is higher than said first threshold level.