发明名称 |
WIRING PATTERN MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD, AND TRANSFER MEMBER |
摘要 |
The purpose of the present invention is to provide a new method as a technology replacing the conventional technology for obtaining a thin film with a wiring pattern. The method for manufacturing a wiring pattern according to the present invention is characterized by being provided with: a laminate forming step of forming a laminate by bringing a first member having a resist layer and a metal layer formed on the resist layer, and a second member having a substrate into contact with each other; a resist layer patterning step of patterning the resist layer; and an etching step of selectively removing the metal layer. |
申请公布号 |
WO2016204207(A1) |
申请公布日期 |
2016.12.22 |
申请号 |
WO2016JP67870 |
申请日期 |
2016.06.16 |
申请人 |
NIKON CORPORATION |
发明人 |
NAKAZUMI Makoto;NISHI Yasutaka;NARA Kei |
分类号 |
H01L21/28;H01L21/336;H01L29/417;H01L29/786 |
主分类号 |
H01L21/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|