ORGANIC LIGHT-EMITTING DIODE PACKAGING METHOD, PACKAGING STRUCTURE, AND DEVICE HAVING SAME

摘要

Disclosed is a an organic light-emitting diode packaging method, comprising: disposing a first substrate (11), the first substrate (11) being made from metal foils; disposing an organic light-emitting diode (12) on the first substrate (11); disposing a passivation layer (13) outside the organic light-emitting diode (12) for covering the organic light-emitting diode (12); coating a packaging adhesive (14) on the whole first substrate (11), such that the packaging adhesive (14) covers the passivation layer (13); disposing a second transparent substrate (15) on at least the part, covering the passivation layer (13), of the packaging adhesive (14); and solidifying the packaging adhesive (14) to form an organic light-emitting diode package. Also disclosed are a packaging structure for an organic light-emitting diode and an organic light-emitting diode device having the packaging structure.