| 摘要 |
<p>A dicing adhesive sheet having a base film and an adhesive layer formed on the base film is characterized in that the thickness of the adhesive layer ranges from 1 to 10 mu m and the adhesive layer has a sticking temperature such that the adhesion measured when 180 DEG peeling at 23 DEG C of the dicing sheet is conducted (the peeling rate is 300 mm/min) after it is applied to a silicon mirror wafer is 10 N/25 mm or more. In a dicing method using such a dicing adhesive sheet, the production yield of a diced body such as a semiconductor wafer is high, and chipping the dicing is prevented. <IMAGE></p> |
