| 摘要 |
A semiconductor power module has a base plate or direct mounting on a cooling body and comprises a housing (50), isolating substrate (20) with many isolated metal connections (24) to semiconductor elements and at least one sensor (40) connected to an external evaluation unit and electrically connected to the base plate. An independent claim is also included for a module as above in which the sensor is mounted on a second of the two main substrate surfaces. |
