PLATED TERMINATION AND METHOD OF FORMING THE SAME USING ELECTROLYTIC PLATING

摘要

PROBLEM TO BE SOLVED: To provide plated terminations and a method of forming the same using electrolytic plating. SOLUTION: A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups. Each exposed portion is within a predetermined distance from other exposed portions in a given group such that termination structures may be formed by deposition and controlled bridging of a thin-film plated material among selected elements of the exposed internal conductive elements. Electrolytic plating is employed in conjunction with optional cleaning and annealing steps to form directly plated portions of copper, nickel or other conductive materials. COPYRIGHT: (C)2008,JPO&INPIT