| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible printed circuit board which prevents an electrode of an conductor circuit from being covered with an adhesive, and provides a sufficient adhesive force between a base film and a cover lay film. SOLUTION: The method of manufacturing a flexible printed circuit board includes the steps of: preparing a base film 4 and a cover lay film 8, that is, the base film 4 including a first film layer 5, a first adhesive layer 6 provided on the first film layer 6, and a conductor circuit 12 having electrodes 13 provided on the first adhesive layer 6, and the cover lay film 8 including a second film layer 10 provided with openings 11 for exposing the electrodes 13, and a second adhesive layer 9 provided on the second film layer 10; inserting heating members in the respective openings 11, heating the second adhesive layer 9 in the vicinity of the openings 11 by heating the heating members 30, and promoting setting of the adhesive; and positioning the cover lay film 8 on face sides of the conductor circuit 12 to be contacted with the second adhesive layer 9, and bonding the base film 4 and the cover lay film 8. COPYRIGHT: (C)2008,JPO&INPIT
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