| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring member for a semiconductor device that enables an internal terminal face having a semiconductor element mounted thereon and an internal terminal portion electrically connected to the semiconductor element to be uniform in height, and also enables etching removal of a metal plate and omission of a step of forming an opening portion through which only an external terminal portion is exposed in a semiconductor device manufacturing process, thereby reducing the number of steps in the semiconductor device manufacturing process and thus enabling manufacturing of a resin sealed type semiconductor device having high reliability, and a manufacturing method for the substrate.SOLUTION: A first noble metal plating layer 11 serving as an internal terminal is formed at a predetermined site on one surface 15a of a resin layer 15 while the lower surface thereof is exposed to constitute the same plane together with the one surface 15a of the resin layer. A metal plating layer 12 is formed on the first noble metal plating layer so as to have the same shape as the first noble metal plating layer. A second noble metal plating layer 14 partially serving as an external terminal is formed on the metal plating layer while the upper surface thereof is exposed from the other surface 15b of the resin layer.SELECTED DRAWING: Figure 1 |
