| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition capable of forming a cured film which is not brittle and good in heat resistance even by a low-temperature curing process. <P>SOLUTION: A first conductor layer 3, a second conductor layer 7 and an interlayer insulating film 4 are formed on a semiconductor substrate 1 on which a protective film 2 has been formed. The positive photosensitive resin composition is applied onto the interlayer insulating film 4 and the second conductor layer 7 by a spin coating method, dried, irradiated with light through a mask patterned to form windows 6c in predetermined parts, and developed with an aqueous alkali solution to form a pattern. Heating (curing) is then performed to form a surface protective film 8. This protective film 8 protects the conductor layers 3, 7 from external stress, α-rays, etc., and the resulting semiconductor device has excellent reliability. <P>COPYRIGHT: (C)2011,JPO&INPIT |
