| 发明名称 |
TENSILE STRESS MEASUREMENT DEVICE WITH ATTACHMENT PLATES AND RELATED METHODS |
| 摘要 |
A tensile stress measurement device is to be attached to an object to be measured. The tensile stress measurement device may include an IC having a semiconductor substrate and tensile stress detection circuitry, the semiconductor substrate having opposing first and second attachment areas. The tensile stress measurement device may include a first attachment plate coupled to the first attachment area and extending outwardly to be attached to the object to be measured, and a second attachment plate coupled to the second attachment area and extending outwardly to be attached to the object to be measured. The tensile stress detection circuitry may be configured to detect a tensile stress imparted on the first and second attachment plates when attached to the object to be measured. |
| 申请公布号 |
US2016223444(A1) |
申请公布日期 |
2016.08.04 |
| 申请号 |
US201514610068 |
申请日期 |
2015.01.30 |
| 申请人 |
STMICROELECTRONICS S.r.l. |
发明人 |
PAGANI Alberto;MURARI Bruno;ZIGLIOLI Federico Giovanni |
| 分类号 |
G01N3/08;H01L21/52;H01L21/56 |
主分类号 |
G01N3/08 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A tensile stress measurement device to be attached to an object to be measured, the tensile stress measurement device comprising:
at least one integrated circuit (IC) comprising a semiconductor substrate and tensile stress detection circuitry thereon, said semiconductor substrate having opposing first and second attachment areas; a first attachment plate coupled to said first attachment area and extending outwardly therefrom to be attached to the object to be measured; and a second attachment plate coupled to said second attachment area and extending outwardly therefrom to be attached to the object to be measured; said tensile stress detection circuitry configured to detect a tensile stress imparted on said first and second attachment plates when attached to the object to be measured. |
| 地址 |
Agrate Brianza IT |
