发明名称 Method of manufacturing thin-film photovoltaic module
摘要 A method of manufacturing a thin-film photovoltaic module in which a photoelectric conversion element is deposited on a substrate, includes removing the photoelectric conversion element at a frame shape area from sides of the substrate toward inside with a predetermined width by a first removing step of scanning a first photoelectric conversion element removing device at the area along the sides of the substrate to remove the photoelectric conversion element for the predetermined width, and a second removing step of scanning a second photoelectric conversion element removing device within the area along the sides of the substrate to remove the photoelectric conversion element that is not removed in the first removing step at a width narrower than the predetermined width and without superimposing a center line of a scanning path on a center line of a scanning path of the first photoelectric conversion element removing device.
申请公布号 US9431571(B2) 申请公布日期 2016.08.30
申请号 US201314416108 申请日期 2013.07.04
申请人 SOLAR FRONTIER K.K.;HITACHI ZOSEN CORPORATION 发明人 Nishijima Yoshiya;Miyano Tetsuo;Tanaka Hideo;Sakai Ichiro;Yamashita Takuto;Yamada Hiroki;Nakayama Shigeaki
分类号 H01L21/00;H01L31/18;H01L31/048;H01L31/046 主分类号 H01L21/00
代理机构 IPUSA, PLLC 代理人 IPUSA, PLLC
主权项 1. A method of manufacturing a thin-film photovoltaic module in which a photoelectric conversion element is deposited on a substrate and insulation properties of a peripheral portion of the substrate is ensured, the photoelectric conversion element including a first electrode layer, a thin-film photoelectric conversion layer and a second electrode layer stacked in this order, the method comprising removing the photoelectric conversion element deposited on the entirety of the substrate at a frame shape area from sides of the substrate toward inside with a predetermined width by performing for each of the sides of the substrate, a first removing step of scanning a first photoelectric conversion element removing device along the respective side of the substrate for a plurality of times while shifting the first photoelectric conversion element removing device in a direction that is perpendicular to the respective side every time the first photoelectric conversion element removing device scans along the respective side of the substrate, at the area from the respective side of the substrate toward inside with the predetermined width along the respective side of the substrate to remove the photoelectric conversion element deposited on the substrate for the predetermined width, anda second removing step of scanning a second photoelectric conversion element removing device, within the area at which the photoelectric conversion element is removed in the first removing step, along the respective side of the substrate to remove the photoelectric conversion element that is not removed in the first removing step at a width narrower than the predetermined width such that a center line of a scanning path of the second photoelectric conversion element removing device is positioned between two adjacent center lines of two adjacent scanning paths of the first photoelectric conversion element removing device in the first removing step.
地址 Tokyo JP