发明名称 LEAD PIN FOR PACKAGE SUBSTRATE
摘要 PURPOSE: A lead pin is provided to prevent the contamination by restricting the movement of a solder paste to the lead pin direction. CONSTITUTION: A connection pin(110) is inserted to a hole. A head unit(120) is formed on one end of the connection pin. A movement prevention unit prevents the paste from moving to the connection pin direction. The movement prevention unit comprises a concave unit on the upper part of the head unit. The concave unit comprises a vertical part which is placed in parallel with the connection pin and a horizontal part which is combined with the vertical part as one body.
申请公布号 KR20110033966(A) 申请公布日期 2011.04.04
申请号 KR20090089706 申请日期 2009.09.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI, JIN WON;MOON, SEUNG JEAN;LEE, KI TAEK
分类号 H01R12/71;H01R12/57 主分类号 H01R12/71
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