发明名称 METHOD FOR MOLDING THERMOSETTING RESIN MOLDING COMPOUND
摘要 PROBLEM TO BE SOLVED: To provide a method for easily molding a large-sized thin thermosetting resin molded product, which is difficult to mold heretofore in a method for molding a molded product from a thermosetting resin molding compound low in resin content and low in flowability, with high accuracy. SOLUTION: In the method for molding the thermosetting resin molded product with a plane size of 200 cm<2> or more and a thickness of 2.5 mm or less, a composition containing a thermosetting resin and a base material is melted and kneaded by a heating roll to be taken out as a sheetlike molding material and this sheetlike molding material is subsequently processed so as to have a size being 40-100% of the plane size of the molded product and this processed sheetlike molding material is molded in a mold under heating and pressure.
申请公布号 JP2002273748(A) 申请公布日期 2002.09.25
申请号 JP20010077540 申请日期 2001.03.19
申请人 SUMITOMO BAKELITE CO LTD 发明人 FUJII SHUNSUKE
分类号 B29C43/02;B29K103/04;C08K3/04;C08L101/00;H01M8/02 主分类号 B29C43/02
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