发明名称 |
POLISHING END POINT DETECTION FOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a technique that can detect a polishing end point with the use of a principle different from frictional force and light reflectance. SOLUTION: A two-dimensional image of a polished surface of a substrate is acquired, and the two-dimensional image is analyzed to compute entropies H1 and H2 of the two-dimensional image. The entropies H1 and H2 are used to determine a polishing end point of the substrate. The entropies H1 and H2 can be replaced with another image feature such as a difference statistic of the image. |
申请公布号 |
JP2002273653(A) |
申请公布日期 |
2002.09.25 |
申请号 |
JP20010076055 |
申请日期 |
2001.03.16 |
申请人 |
DAINIPPON SCREEN MFG CO LTD |
发明人 |
SHIOMI JUNICHI;FUJIMOTO HIROMI;NISHIHARA EIJI;IMAMURA ATSUSHI |
分类号 |
B24B49/12;B24B37/013;G06T1/00;G06T7/00;G06T7/40;H01L21/304 |
主分类号 |
B24B49/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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