| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad capable of providing excellent flattening characteristics and flattening uniformity to a body to be polished such as a semiconductor wafer without generating a scratch and a manufacturing method for a semiconductor device using the polishing pad. <P>SOLUTION: The polishing pad includes a polishing layer and a cushioning layer, and polishes the semiconductor wafer. In the polishing pad, the polishing layer is formed of polyurethane foam, and has a flexural modulus of 250 to 350 MPa. In the polishing pad, the cushioning layer is formed of closed-cell foam, and has a thickness of 0.5 to 1.0 mm and a strain constant of 0.01 to 0.08 μm/(gf/cm<SP>2</SP>). <P>COPYRIGHT: (C)2005,JPO&NCIPI |
