| 摘要 |
<P>PROBLEM TO BE SOLVED: To securely engage terminals with through holes in a control substrate in a semiconductor device having the comparatively large substrate and the large number of terminals. <P>SOLUTION: Lengths of terminals 30 and 32 differ in a plurality of power element units. Timing that the terminals 30 and 32 pass the through holes 14b differs in the power element 16 unit. Enlargements 34b and 36b of positioning pins 34 and 36 are arranged so that height is matched with a tip of the terminal 30 or 32. The enlargements 34b and 36b are guided to peripheral walls of positioning holes 14a, and center positions are matched with center positions of the positioning holes 14a. Thus, the circuit board 14 moves to a housing 18. The terminals 30 and 32 are matched with the through holes 14b and they smoothly engage with them. The respective positioning pins position the circuit board 14 and the housing 18 at height where positioning functions are to be displayed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
