| 摘要 |
<p>A method for manufacturing a semiconductor light emitting device having a metal plate is provided to easily radiate the heat generated from a semiconductor chip outwardly by using a lead frame directly contacted the semiconductor chip. A lead frame(30) supporting a semiconductor chip is formed by using a metal plate. Plural channels(31) are formed on a front surface of the metal plate in vertical and horizontal directions to define unit regions. Plural rear grooves(32) are formed on a rear surface of the metal plate at center portions of metal posts(33), and the metal post penetrates a rear groove region of the lead frame. In this instance, an insulator(34) is interposed between the metal post and the lead frame. A semiconductor chip is attached to the front surface of the lead frame every unit region. A guard rail is formed on the lead frame at centers of the channels. A portion of the lead frame corresponding to the channels is cut, and the guard rail is removed.</p> |
