| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device, substrate drying method, and substrate processing method, capable of suppressing the atmosphere around a substrate from sucked into the peripheral part of the substrate. SOLUTION: After the surface of a wafer W is processed with a chemical liquid, the surface of the wafer W is rinsed by DIW while a surface 14 counter to a shielding plate 4 is close to the surface of the wafer W held by a spin chuck 2 (refer to figure 4(b)). Here, the tip edge of a sponge member 26 so attached to the peripheral part of the shielding plate 4 as to protrude to the wafer W side form the counter surface 14 faces the peripheral edge of the surface of the wafer W, thereby suppressing a surrounding atmosphere from sucked into the space between the wafer W and the shielding plate 4. After rinsing, with the space kept as nitrogen gas atmosphere, the wafer W is rotated at a specified high rotational speed so that the wafer W is dried (refer to figure 4(c)). COPYRIGHT: (C)2008,JPO&INPIT
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