| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component storing substrate which can prevent short-circuiting among the electrodes of the electronic components, and to provide the electronic component storing substrate. SOLUTION: When the electronic component storing substrate 50 for storing an electronic component 60, having a longitudinal shape and provided with electrodes 62a, 62b on respective end parts in the longitudinal direction in a through hole 15 of a printed board 20 is to be manufactured, the through hole 15 is pierced so as to form gap parts 22 extending in a penetration direction, when the electronic component 60 is stored in the through hole 15, the electronic component 60 is stored in the through hole 15 with the gap parts 22 so that the longitudinal direction substantially coincides with the penetration direction of the through hole 15, photocuring insulating resin 24 is applied to the gap parts 22 from the one face A20 side of the printed board 20 to the other face B20 side so that the electrode 62b of the electronic component 60 on the other face side is exposed; and after selectively curing an inter-electrode region in the gap parts 22 of the insulating resin, by irradiating the insulating resin with light L1 from the other face side, uncured insulating resin is removed. COPYRIGHT: (C)2008,JPO&INPIT
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