Substrate structure and semiconductor package using the same

摘要

A substrate structure is provided, including a substrate body and a plurality of circuits formed on the substrate body. At least one of the circuits has an electrical contact for connecting to an external element and the electrical contact is narrower in width than the circuit, thereby meeting the requirements of fine line/fine pitch and miniaturization, improving the product yield and reducing the fabrication cost.

主权项

1. A substrate structure, comprising:
a substrate body; and a plurality of circuits formed on the substrate body, wherein at least one of the circuits has an electrical contact formed on the substrate body, the electrical contact is configured for connecting to an external element by the electrical contact being in contact with a conductive bump, the electrical contact and the circuit are in contact with a surface of the substrate body, the electrical contact is narrower in width than the circuit, the electrical contact directly connects to the circuit, and the circuits are free from covering a top surface of the electrical contact.