SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device, which allow mixed loading of dissimilar devices and achieve high yield.SOLUTION: A semiconductor device manufacturing method comprises: an adhesive layer formation process (S1) of forming an adhesive layer on a first semiconductor wafer having an electrode on a surface having the electrode; an electrode exposure process (S2) of removing at least a part of the adhesive layer on the electrode of the first semiconductor wafer to expose at least a part of the electrode of the semiconductor wafer; a dicing process (S3) of dicing the first semiconductor wafer to obtain first semiconductor chips; a thermocompression bonding process (S4) of thermocompression bonding the electrodes of the first semiconductor chips, which are at least partially exposed with electrodes of a second semiconductor wafer having the electrodes to obtain a laminate; and a reflow process (S5) of reflowing the laminate.SELECTED DRAWING: Figure 1