Method for the temporary connection of a product substrate to a carrier substrate

摘要

A method for temporary connection of a product substrate to a carrier substrate comprised of the steps of:
applying an interconnect layer to a product substrate receiving side of the carrier substrate in an interconnect surface section of the product substrate receiving side,applying an antiadhesion layer with low adhesion force to one interconnect side of the product substrate in an antiadhesion surface section of the interconnect side, the antiadhesion surface section corresponding to the interconnect surface section, in terms of area, wherein a receiving space is formed which is bordered by the interconnect layer and the carrier substrate as well as the product substrate and the antiadhesion layer accommodating structures which are provided on the interconnect side of the product substrate and which project from the interconnect side,aligning the product substrate relative to the carrier substrate and bonding of the interconnect layer to the antiadhesion layer on one contact surface.

主权项

1. A method for temporary connection of a product substrate to a carrier substrate comprising the following steps:
applying an interconnect layer to a product substrate receiving side of the carrier substrate in an interconnect surface section of the product substrate receiving side, applying an antiadhesion layer with low adhesion force to one interconnect side of the product substrate in an antiadhesion surface section of the interconnect side, the antiadhesion surface section corresponding to the interconnect surface section in terms of area, aligning the product substrate relative to the carrier substrate, bonding the interconnect layer to the antiadhesion layer on one contact surface, and stripping the carrier substrate from the product substrate, wherein a receiving space is formed that is bordered by the interconnect layer and the carrier substrate as well as the product substrate and the antiadhesion layer, the receiving space being configured to accommodate structures provided on the interconnect side of the product substrate and projecting therefrom.