发明名称 Wire harness
摘要 The purpose of the present invention is to provide a wire harness which allows only the nonwoven fabric exterior structure to be disassembled without damaging an interior wire bundle. A wire harness according to the present invention has a nonwoven fabric exterior structure obtained by heat-molding while a wire bundle is wound with the nonwoven fabric. The nonwoven fabric exterior structure protects a part of the outer periphery of the wire bundle. The wire harness is provided with a paper tape that is provided with a part thereof exposed from the outer peripheral surface of the nonwoven fabric exterior structure. The paper tape is heat-molded together with the nonwoven fabric with the tip sticking out from the winding end edge so that the base portion of the tip exposed from the outer peripheral surface of the nonwoven fabric exterior structure shows the position of the winding end edge.
申请公布号 US9390836(B2) 申请公布日期 2016.07.12
申请号 US201314430080 申请日期 2013.06.12
申请人 SUMITOMO WIRING SYSTEMS, LTD. 发明人 Hasegawa Katsumi
分类号 H01B7/38;H01B7/17;H01B7/00 主分类号 H01B7/38
代理机构 Greenblum & Bernstein, P.L.C. 代理人 Greenblum & Bernstein, P.L.C.
主权项 1. A wire harness comprising: a wire bundle; a nonwoven fabric exterior structure that is formed by being heat-molded in a state where a nonwoven fabric covers the wire bundle, and has a nonwoven fabric edge during molding; and an auxiliary member that is formed on an outer peripheral surface of the nonwoven fabric exterior structure so that a formation position of the nonwoven fabric edge can be visually recognized, the auxiliary member extends circumferentially around the wire bundle on an inner surface of the nonwoven fabric exterior structure between the wire bundle and the nonwoven fabric exterior structure, wherein the nonwoven fabric exterior structure has a structure that is obtained by performing heat-molding in a condition in which the wire bundle is wound with the nonwoven fabric, and the nonwoven fabric edge has a winding end edge that is formed on an outer peripheral surface along a longitudinal direction of the wire bundle.
地址 Mie ES