Passivated microelectromechanical structures and methods

摘要

This disclosure provides systems, methods and apparatus including devices that include a layer of passivation material covering at least a portion of an exterior surface of a thin film component within a microelectomechanical device. The thin film component may include an electrically conductive layer that connects via an anchor to a conductive surface on a substrate. The disclosure further provides processes for providing a layer of passivation material on an exterior surface of a thin film component and for electrically connecting that thin film component to a conductive surface on a substrate.

主权项

1. A device comprising,
a substrate having a surface, a first thin film beam and a second thin film beam, the first thin film beam being arranged between the substrate and the second thin film beam, and the first thin film beam being suspended over the substrate, and the second thin film beam being suspended over the first thin film beam, and the first thin film beam having a first arm and the second thin film beam having a second arm, each arm extending toward the surface of the substrate, and the first arm being joined to and overlapping the second arm and the first and second arms forming an anchor capable of holding the first thin film beam and the second thin film beam a distance away from the substrate.