Methods for deposition of materials including mechanical abrasion

摘要

Methods described herein may be useful in the fabrication and/or screening of devices (e.g., sensors, circuits, etc.) including conductive materials. In some embodiments, a conductive material is formed on a substrate using mechanical abrasion. The methods described herein may be useful in fabricating sensors, circuits, tags for remotely-monitored sensors or human/object labeling and tracking, among other devices. In some cases, devices for determining analytes are also provided.

主权项

1. A method for fabricating a device, comprising:
arranging a plurality of devices to form an array, wherein each individual device includes a species responsive to an analyte, such that a first device includes a species responsive to a first analyte and a second device includes a species responsive to a second analyte, the first and second analytes being different, wherein each individual device is formed by: providing an article comprising a conductive material, wherein the conductive material comprises nanostructures; contacting the article with a surface of a substrate, a first electrode, and a second electrode via mechanical abrasion, thereby forming the conductive material on the surface of the substrate, the first electrode, and the second electrode, and forming an electrical circuit comprising the conductive material.