Device for measuring mechanical quantity

摘要

A device for measuring mechanical quantity is provided which reduces the influence of a difference in thermal expansion coefficient between an object to be measured and a base plate metal body, and precisely measures a mechanical quantity such as deformation quantity or strain quantity caused in the object to be measured. The device includes a semiconductor strain sensor module for measuring deformation quantity of the object to be measured, and the module includes a metal body, and a semiconductor strain sensor mounted on the metal body to detect strain of the metal body. The object to be measured is made of a material having a thermal expansion coefficient larger than that of the metal body. Further, the metal body mounted with the semiconductor strain sensor has a structure configured to be fixed to the object to be measured.

主权项

1. A device for measuring mechanical quantity, the device measuring deformation quantity of an object to be measured, the device comprising:
a metal body; and a semiconductor strain sensor mounted on the metal body and configured to detect strain of the metal body; wherein the object to be measured includes a material having a thermal expansion coefficient larger than that of the metal body, the metal body mounted with the semiconductor strain sensor has a structure to be fixed to the object to be measured, and the object to be measured is fixed only on one side of the metal body mounted with the semiconductor strain sensor; and wherein the metal body comprises a projection on a surface making contact with the object to be measured, and the metal body generates “compression strain” by a negative pressure through the projection, while no load is applied to the object to be measured.