Weak bond detection

摘要

Apparatuses and methods are disclosed for determining whether a structure of bonded layers includes locations where the layers are weakly bonded. Embodiments include evaluating the frequency response of the structure in response to vibrational inputs. Alternate embodiments include evaluating the non-linear response of the structure using a modal analysis. Further embodiments include obtaining the vibrational information with an accelerometer contacting the structure, while additional embodiments include exciting the structure with an impact force, which may be applied at multiple locations on the structure's surface. Still further embodiments include performing a MAC, COMAC, and/or FRF analysis. Still other embodiments include varying the amplitude of the input vibration. Additional embodiments locate the areas of weakened bonding. Still other embodiments include methods and apparatuses for simulating a laminated structure with defective bonding, such as kiss bonding.

主权项

1. A method, comprising the acts of:
vibrating a structure of bonded layers at a first amplitude by impacting the surface of the structure; vibrating the structure at a second amplitude different from the first amplitude by impacting the surface of the structure; evaluating a modal response of the structure to said vibrating at a first amplitude; evaluating a modal response of the structure to said vibrating at a second amplitude; correlating the modal responses; and determining the existence of weak bonding between layers of the structure by identifying a weak correlation between the modal responses.