POLISHING COMPOSITION AND POLISHING METHOD

摘要

The invention of the present application relates to: a polishing composition comprising water and silica, wherein the silica has a BET specific surface area of 30 m2/g or more and a NMR specific surface area of 10 m2/g or more; and a polishing method using the polishing composition. In the polishing composition according to the invention of the present application, silica to be used is one having a BET specific surface area falling within the above-mentioned range and also having a NMR specific surface area falling within a specified range. Therefore, a high polishing rate can be achieved, and the polishing rate can be maintained even when the polishing composition is used for a long period.