发明名称 PACKAGE FOR HOUSING LIGHT-EMITTING ELEMENT, LIGHT-EMITTING APPARATUS AND ILLUMINATION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a package for housing a light-emitting element and light-emitting apparatus in which a radiation strength is high and optical characteristics such as luminance, light performance and the like are improved. <P>SOLUTION: The package for housing the light-emitting element comprises: a base body 1 including a mounting portion 1a which is formed in a central portion on an upper principal surface so as to be protruded, for mounting a light-emitting element 5 thereon; a frame-like reflection member 2 which is joined to the upper principal surface of the base body 1 to surround the mounting portion 1a, with its inner peripheral surface shaped into a reflection surface 2b for reflecting light emitted by the light-emitting element 5; and a conductor layer 7 which is formed on an upper surface of the mounting portion 1a, for electrically connecting the light-emitting element 5 via a conductive adhesive material 8. The vicinity of the conductor layer 7 is surrounded with a projecting portion 9 composed of an insulator. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005210043(A) 申请公布日期 2005.08.04
申请号 JP20040071434 申请日期 2004.03.12
申请人 KYOCERA CORP 发明人 URATANI MITSUGI;SAKUMOTO DAISUKE;MIYAKE TORU
分类号 H01L33/56;H01L33/58;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/56
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