ADHESIVE COMPOSITION, AND FILM ADHESIVE AND CIRCUIT CONNECTION MATERIAL PRODUCED BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition having quick curability at low temperature and excellent connection property. SOLUTION: The adhesive composition comprises (A) a polyurethane imide expressed by general formula (I), (B) a modified polyurethane expressed by general formula (II) and (C) a radical polymerization initiator. COPYRIGHT: (C)2008,JPO&INPIT