发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of achieving higher hardness while using an epoxy group-containing acrylic resin, a photosensitive resin laminate and a pattern forming method. <P>SOLUTION: The photosensitive resin composition comprises (A) the epoxy group-containing acrylic resin, (B) a photopolymerization initiator and (C) a sensitizer, wherein an onium salt of a specific structure is used as the component (B) and at least one selected from 1,5-dihydroxynaphthalene, 2,3-dihydroxynaphthalene and 2,6-dihydroxynaphthalene is used as the component (C). <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008310089(A) 申请公布日期 2008.12.25
申请号 JP20070158320 申请日期 2007.06.15
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SENZAKI TAKAHIRO;MISUMI KOICHI;SAITO KOJI
分类号 G03F7/029;C08G59/68;G03F7/004;G03F7/038;G03F7/11;H05K3/00 主分类号 G03F7/029
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