发明名称 Laminated ceramic electronic component
摘要 In a laminated ceramic capacitor, a cylindrical ceramic part of its ceramics includes, in a manner not exposed to the surface of the ceramics, a cylinder-shaped high-void-ratio part which has a void ratio higher than the void ratio in the cylindrical ceramic part other than the high-void-ratio part and which has two layered parts facing the left and right sides of each layered conductor, respectively, as well as two layered parts facing the outer surfaces of the two outermost layered conductors, respectively. The laminated ceramic electronic component inhibits cracking of its sintered chip.
申请公布号 US9368281(B2) 申请公布日期 2016.06.14
申请号 US201113817409 申请日期 2011.06.13
申请人 TAIYO YUDEN CO., LTD. 发明人 Morita Koichiro;Imai Atsushi
分类号 H01G4/30;H01G4/06;H01G4/12 主分类号 H01G4/30
代理机构 Law Office of Katsuhiro Arai 代理人 Law Office of Katsuhiro Arai
主权项 1. A laminated ceramic electronic component having a sintered chip of roughly rectangular solid shape constituted by ceramics and many layered conductors arranged therein in a manner facing each other, with the ceramics constituting the sintered chip divided into many layered ceramic parts present between the layered conductors and a cylindrical ceramic part present in a manner surrounding the entire layered conductors; wherein the cylindrical ceramic part of the ceramics includes, in a manner not exposed to a surface of the cylindrical ceramic part nor contacting the layered conductors, a high-void-ratio part which has a void ratio higher than a void ratio at any part of the cylindrical ceramic part other than the high-void-ratio part and which also has at least two layer-parts facing each other and extending in a direction parallel to a lamination direction of the layered conductors along sides of the layered conductors, in which high-void-ratio part pores are randomly distributed.
地址 Tokyo JP