发明名称 |
Patterned die attach and packaging method using the same |
摘要 |
A semiconductor die is attached to a packaging substrate by a patterned layer of conductive metal that includes voids. The voids provide a space into which the metal may expand when heated in order to avoid placing mechanical stress on the bonds caused by mismatches in the thermal coefficients of thermal expansion of the die, the conductive metal bond layer and the substrate. An additional coating of conductive metal may be flowed over the bond lines to reinforce the bonds.
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申请公布号 |
US7939376(B2) |
申请公布日期 |
2011.05.10 |
申请号 |
US20100851699 |
申请日期 |
2010.08.06 |
申请人 |
THE BOEING COMPANY;AUBURN UNIVERSITY |
发明人 |
PELTZ LEORA;JOHNSON WAYNE |
分类号 |
H01L21/48 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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