SEMICONDUCTOR DEVICE

摘要

In a semiconductor device (100), a heat sink (2) is sealed in a sealing resin (8). An insulation sheet (3) is attached so as to come into contact with one main surface of the heat sink (2) in the sealing resin (8). A lead frame (4) extends from within the sealing resin (8) so as to reach the outside of the sealing resin (8), and is mounted onto a main surface of the insulation sheet (3) on a side opposite the heat sink (2). Semiconductor elements (1) are joined to at least a part of the main surface of the lead frame (4) on a side opposite the insulation sheet (3) within the sealing resin (8). A surface of the insulation sheet (3) on a side that is in contact with the lead frame (4) is inclined and is lower so as to be distanced from the lead frame (4) in end section regions that include at least a part of the outermost ends of the insulation sheet (3) in plan view. The sealing resin (8) has entered between the lead frame (4) and the insulation sheet (3) in the end regions. The lead frame (4) is flat at least within the sealing resin (8).