发明名称 電子部品実装装置
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting device capable of preventing a quantity of misalignment of an electronic component from the center line of a suction nozzle thereof from being misdetected in such a case.SOLUTION: A reference mark member 60 having a reference mark 63b, specifying the position of a suction nozzle 96a, formed on a mark surface 63a is fitted to a pivot part 95a of a mounting head 95 in a swingable state, and the reference mark member 60 is swung by an actuator 65 between a measurement position where the mark surface 63a is horizontal and a standby position where the reference mark 63b is not imaged by an imaging device. Consequently, when a quantity of misalignment of an electronic component P2 is detected without using the reference mark 63b, the reference mark 63b is not imaged by the imaging device together with the electronic component P2 while the reference mark member 60 stands by at the standby position, and the reference mark 63b is not recognized as a part of the electronic component P2, so that the quantity of misalignment of the electronic component P2 is prevented from being misdetected.
申请公布号 JP5971930(B2) 申请公布日期 2016.08.17
申请号 JP20110262947 申请日期 2011.11.30
申请人 富士機械製造株式会社 发明人 山蔭 勇介;井土 武洋
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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