发明名称 Thin film, method of forming thin film, semiconductor device including thin film, and method of manufacturing semiconductor device
摘要 A thin film, a method of forming the thin film, a semiconductor device including the thin film, and a method of manufacturing the semiconductor device include forming a thin film including a metal oxynitride, and treating the thin film with inert gas ions so as to stabilize properties of the thin film. The metal oxynitride may include zinc oxynitride (ZnOxNy). The inert gas ions may include at least one of Ar ions and Ne ions. The treating of the thin film with the inert gas ions may be performed by a sputtering process, a plasma treatment process, or the like.
申请公布号 US9425323(B2) 申请公布日期 2016.08.23
申请号 US201414177513 申请日期 2014.02.11
申请人 Samsung Electronics Co., Ltd. 发明人 Lee Eun-ha;Benayad Anass;Kim Tae-sang;Son Kyoung-seok
分类号 H01L21/02;H01L29/786;H01L29/66 主分类号 H01L21/02
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A method of forming a thin film, the method comprising: forming a preliminary thin film including a metal oxynitride on a substrate; and treating the preliminary thin film with inert gas ions to form the thin film having stabilized properties, the thin film being a semiconductor film, wherein the treating of the preliminary thin film with the inert gas ions includes performing a sputtering process, the sputtering process including using an acceleration voltage of about 0.5 keV to about 4.0 keV.
地址 Gyeonggi-Do KR