发明名称 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a reliable semiconductor device including an oxide semiconductor and having the stable electric characteristics.SOLUTION: A manufacturing method for a semiconductor device includes: forming a gate electrode; forming a first insulating film on the gate electrode; supplying halogen atoms to the first insulating film by performing a halogen doping process on the first insulating film; forming an oxide semiconductor film overlapping with the gate electrode on the first insulating film; heating the oxide semiconductor film to remove hydrogen atoms from the oxide semiconductor film; supplying oxygen atoms to the oxide semiconductor film by performing an oxygen doping process to the oxide semiconductor film from which the hydrogen atoms have been removed; heating the oxide semiconductor film to which the oxygen atoms have been supplied; forming a source electrode and a drain electrode on and in contact with the oxide semiconductor film; and forming a second insulating film.SELECTED DRAWING: Figure 2
申请公布号 JP2016157959(A) 申请公布日期 2016.09.01
申请号 JP20160065102 申请日期 2016.03.29
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 H01L29/786;H01L21/265;H01L21/336;H01L21/425;H01L21/477;H01L21/8234;H01L21/8242;H01L27/08;H01L27/088;H01L27/108;H01L27/146;H01L51/50;H05B33/10;H05B33/14 主分类号 H01L29/786
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