| 发明名称 | Air trench in packages incorporating hybrid bonding | ||
| 摘要 | A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench. | ||
| 申请公布号 | US9443796(B2) | 申请公布日期 | 2016.09.13 |
| 申请号 | US201313895122 | 申请日期 | 2013.05.15 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Chou Bruce C. S.;Wang Chen-Jong;Liu Ping-Yin;Tu Jung-Kuo;Chou Tsung-Te;Huang Xin-Hua;Kuang Xin-Chung;Chao Lan-Lin;Tsai Chia-Shiung;Chen Xiaomeng |
| 分类号 | H01L23/48;H01L23/00;H01L23/498 | 主分类号 | H01L23/48 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A package comprising: a first package component comprising: a first surface dielectric layer comprising a first planar top surface;a first metal pad in the first surface dielectric layer and comprising a second planar top surface level with the first planar top surface; anda first air trench on a side of the first metal pad, wherein a sidewall of the first metal pad and a sidewall of the first surface dielectric layer are both exposed to the first air trench. | ||
| 地址 | Hsin-Chu TW | ||