发明名称 Dicing sheet with protective film-forming layer, and method for producing chip
摘要 A dicing sheet with a protective film-forming layer includes a protective film-forming layer on an adhesive layer of an adhesive sheet with a peel strength adjusting layer being interposed therebetween. The adhesive sheet is composed of a base film and the adhesive layer. The dicing sheet with a protective film-forming layer may also include a laminate of the peel strength adjusting layer and the protective film-forming layer arranged in the inner circumferential part of the adhesive sheet; the adhesive layer is exposed in the outer circumferential part of the adhesive sheet; and the peel strength between the peel strength adjusting layer and a protective film that is obtained by curing the protective film-forming layer is 0.05-5 N/25 mm.
申请公布号 US9443750(B2) 申请公布日期 2016.09.13
申请号 US201214368591 申请日期 2012.12.25
申请人 LINTEC Corporation 发明人 Shinoda Tomonori;Takano Ken
分类号 H01L21/683;H01L23/544;C09J7/02;B32B7/06;H01L21/78 主分类号 H01L21/683
代理机构 Cahn & Samuels, LLP 代理人 Cahn & Samuels, LLP
主权项 1. A dicing sheet with a protective film forming layer comprising: an adhesive sheet formed of a base film and an adhesive layer, wherein the protective film forming layer is formed on the adhesive layer via a release strength adjusting layer, a multilayered body formed of the release strength adjusting layer and the protective film forming layer is formed at an inner peripheral part of the adhesive sheet, and the adhesive layer is uncovered by both the release strength adjusting layer and the protective film forming layer at an outer peripheral part of the adhesive sheet and a release strength between the release strength adjusting layer and a protective film formed by curing the protective film forming layer is 0.05 to 5 N/25 mm.
地址 Tokyo JP