| 发明名称 |
SEMI-CONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME |
| 摘要 |
<p>PURPOSE: A semi-conductor package and a method for fabricating the same are provided to implement sufficient structural rigidity by forming a middle frame supporting an insulating mold to be dipped into an insulated mold. CONSTITUTION: In a semi-conductor package and a method for fabricating the same, a plurality of bonding pads(11) are formed in the top side of a semiconductor chip(10). A plurality of leads(20) is arranged around the semiconductor chip. A barrier is arranged around the lead to seal up the semiconductor chip. The clean area and surrounding region of a middle frame(30) is filled with the insulating mold. A transparent cover is formed in the upper part of the wall.</p> |
| 申请公布号 |
KR20110049940(A) |
申请公布日期 |
2011.05.13 |
| 申请号 |
KR20090106715 |
申请日期 |
2009.11.06 |
| 申请人 |
TERRASEM. CO., LTD. |
发明人 |
SUH, SUNG GI;YE, CHANG SOO;HA, MIN KI;KIM, EUNG KWANG |
| 分类号 |
H01L21/60;H01L23/28;H01L27/146 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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