SEMICONDUCTOR DEVICE INCLUDING STRUCTURE TO CONTROL UNDERFILL MATERIAL FLOW

摘要

A semiconductor device includes a substrate, a semiconductor chip, and an array of contact elements electrically coupling the substrate to the semiconductor chip. The semiconductor device includes an underfill material between the substrate and the semiconductor chip and between the contact elements. A patterned structure is arranged on the substrate and extends from under the semiconductor chip through a keep-out zone around an edge of the semiconductor chip. The patterned structure provides a reservoir for the underfill material.

主权项

1. A semiconductor device comprising:
a substrate; a semiconductor chip; an array of contact elements, a first portion of the array of contact elements electrically coupling the substrate to the semiconductor chip; underfill material between the substrate and the semiconductor chip and between the contact elements; and a patterned structure arranged on the substrate and extending from under the semiconductor chip through a keep-out zone around an edge of the semiconductor chip, the patterned structure providing a reservoir for the underfill material, wherein the patterned structure comprises a second portion of the array of contact elements that do not electrically contact the semiconductor chip.