Movement microelectromechanical systems (MEMS) package

摘要

The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.

主权项

1. A microelectromechanical systems (MEMS) package comprising:
a device substrate comprising a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate; and a CMOS substrate bonded to the device substrate by a first bonding pad attached to the device substrate and a second bonding pad attached to the CMOS substrate, the first bonding pad and the second bonding pad meeting at a bonding interface; wherein a surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon; wherein the conformal anti-stiction layer is disposed between the device substrate and the first bonding pad.