发明名称 MOLD CLAMPING DEVICE AND METHOD FOR CONTROLLING MOLD CLAMPING FORCE
摘要 PROBLEM TO BE SOLVED: To provide a mold clamping device and a method for controlling the mold clamping force capable of relaxing the effect on the mold clamping force due to the gap of two magnetic poles when generating the mold clamping force by using an electromagnet. SOLUTION: The mold clamping device generates the mold clamping force by an electromagnet, and the electromagnet is characterised by generating the rated or the maximum mold clamping force of the mold clamping device in the state in which the increasing rate of magnetic flux density to applied current becomes about 2% or lower comparing with the increasing rate when the magnetic flux density is less than 1 T. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008044317(A) 申请公布日期 2008.02.28
申请号 JP20060224450 申请日期 2006.08.21
申请人 SUMITOMO HEAVY IND LTD 发明人 MORIYA KOJI;MORITA HIROSHI;YAMAMOTO TAIZO
分类号 B29C45/64 主分类号 B29C45/64
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