发明名称 PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To realize simplification of the structure of a plasma treatment device of a so-called remote control type which sprays a treating gas to a treating object arranged in the outside of a discharge space through the discharge space. <P>SOLUTION: A discharge side plate part 31a of a holder 30 is covered on a discharge generation surface 11a of an electrode 11 of an electrode unit 10 and a treatment side plate part 31c is covered on a treatment side surface 11c of the electrode 11. The discharge side plate part 31a and the treatment side plate part 31c have nearly identical thickness. A treating object opposed plate 20 is covered on the treatment side plate part 31c. The treating object opposed plate 20 is made thicker than the treatment side plate part 31c. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008226634(A) 申请公布日期 2008.09.25
申请号 JP20070062928 申请日期 2007.03.13
申请人 SEKISUI CHEM CO LTD 发明人 UEHARA TAKESHI
分类号 H05H1/24;C23C16/50;H01L21/3065 主分类号 H05H1/24
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