发明名称 |
WET ETCH SUITABLE FOR CREATING SQUARE CUTS IN SI AND RESULTING STRUCTURES |
摘要 |
<p>A single crystal silicon etching method includes providing a single crystal silicon substrate having at least one trench therein. The substrate is exposed to a buffered fluoride etch solution which undercuts the silicon to provide lateral shelves when patterned in the <100> direction. The resulting structure includes an undercut feature when patterned in the <100> direction.</p> |
申请公布号 |
EP2030225(A2) |
申请公布日期 |
2009.03.04 |
申请号 |
EP20070795580 |
申请日期 |
2007.05.31 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
LEE, WHONCHEE;FUCSKO, JANOS;WELLS, DAVID, H. |
分类号 |
H01L21/306;B81C1/00;C30B29/06;C30B33/08 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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