发明名称 PATTERN FORMING METHOD AND PATTERN FORMING APPARATUS
摘要 In a pattern forming method of an embodiment, a template pattern formed on a front side of a template is brought into contact with resist placed on a substrate. Moreover, in the pattern forming method, rear pressure being an ambient pressure on a back side of the template is adjusted to a second pressure. Moreover, in the pattern forming method, the resist is filled in the template pattern under the second pressure to be cured.
申请公布号 US2016243753(A1) 申请公布日期 2016.08.25
申请号 US201514844538 申请日期 2015.09.03
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HATANO Masayuki;KAWAMURA Yoshihisa
分类号 B29C59/02 主分类号 B29C59/02
代理机构 代理人
主权项 1. A pattern forming method comprising: bringing a template pattern formed on a front side of a template into contact with resist placed on a substrate; adjusting, to a first pressure, pressure inside an apparatus on which the template is placed; adjusting, to a second pressure, rear pressure being ambient pressure on a back side of the template, the second pressure being lower than the first pressure; filling the resist in the template pattern under the second pressure; and curing the resist.
地址 Tokyo JP