发明名称 |
PLATING SYSTEM WITH REMOTE SECONDARY ANODE FOR SEMICONDUCTOR MANUFACTURING |
摘要 |
The present invention provides an electroplating system (50) for semiconductor wafers (66) including a plating chamber (52) connected by a circulating system (52, 56, 58) to a plating solution reservoir (60). The semiconductor wafer (66) is used as the cathode with an inert primary anode (64) in the plating chamber (52). A consumable remote secondary anode (75) in the plating solution reservoir (60) provides the metal ions for plating. |
申请公布号 |
WO0229875(A3) |
申请公布日期 |
2002.08.15 |
申请号 |
WO2001US18229 |
申请日期 |
2001.06.04 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
TRAN, MINH, QUOC |
分类号 |
C25D7/12;C25D21/14;H01L21/288 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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