发明名称 HEATSINK
摘要 PROBLEM TO BE SOLVED: To improve on heat exchanging performance without incurring cooling water circulation system enlargement and cost elevation or incurring an increase in the manufacturing cost of the heatsink itself. SOLUTION: A plurality of plate-type heat receiving layers 101-105 are laminated and bonded, and an LD array 17 that produces heat is bonded to the upper surface of the top heat receiving layer 101. Heat radiating fins 10-2 and 10-3, equal to a heat radiating fin 10-1 formed on the heat receiving layer 101, are formed on the heat receiving layers 102 and 103 positioned in between the top and bottom heat receiving layers. It is so constituted that the total cross section of coolant ducts 1a-3a adjoining the heat radiating fins 10-1 to 10-3 is equal to the cross section of adjoining ducts precalculated for a model designed to have a heat radiating fin only for one layer. Through holes 2b and 3b are formed for branching the cooling water guided from a water inlet 5 toward the top heat receiving layer 101 into the coolant ducts 2a and 3a adjoining the heat radiating fins 10-2 and 10-3 added to the intermediate heat receiving layers 102 and 103. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005209874(A) 申请公布日期 2005.08.04
申请号 JP20040014598 申请日期 2004.01.22
申请人 FUJI ELECTRIC SYSTEMS CO LTD 发明人 KONOSU NAOHIRO;TAKAHASHI MASATO;YANASE ATSUSHI
分类号 F25D17/02;F25D9/00;H01L23/473;H01S5/024;H05K7/20;(IPC1-7):H01L23/473 主分类号 F25D17/02
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